01 公司簡介‧關於鎧暘 照片2

Products

Black Matrix (BM)

image

Photoresist Material Features

  • High resolution with precise line-edge control: minimum feature size down to 3.5 µm
  • Excellent coating and film-forming stability
  • Wide process window
  • High compatibility with raw materials and other process materials
  • High light-shielding capability
  • High electrical resistivity

Photoresist Material Characteristics

  • Compatible Equipment: Spin Coater & Slit Coater
  • Customizable to meet process requirements
  • Stable and well-controlled
  • Excellent developer resistance and thermal stability

image
image
image

RGB Color Resist

image

Applications of Different Color Gamuts

  • Web / General Displays: sRGB
  • Photography / Printing: Adobe RGB
  • Imaging / Cinema / HDR Displays: DCI-P3
  • UHD / Future Displays: BT.2020
CIE 1931
Coverage
Advantages
sRGB~35% No color management required
Adobe RGB~50% Better for post-processing
DCI-P3~45%Vivid colors
BT. 2020~75%Future display target
image
image

Over Coat (OC)

The main functions of the Over Coat (OC) Resist are to protect the color filter layer and enhance surface smoothness. In addition, it also serves to isolate the liquid crystal and prevent contamination.

Performance & Characteristics

  • High Flatness
  • High Chemical Resistance (especially NMP) 
  • High Transmittance
  • Improve PS ER% (Increase 5~10%)
  • Low Water Absorption
  • Low Temperature Curing (≥150℃)
image

Other Applications

  • PFA_Polymer Film on Array
    • High Resolution (Hole ≤7um)
  • Touch Panel
    • Good Chemical Resistance
  • Micro Lens
    • Refractive Index (1.63)
image
image
oc5
oc6

Products

CF OCPFATP OCHIRF Micro Lens
Curing typeThermalMain UVMain UVMain UV
Material typeSiloxaneAcrylAcrylAcryl

Photo Spacer (PS)


Photo Spacer (PS) This negative type of Photo Spacer (PS) Resist can be used as the spacer for the cell gap in TFT-LCDs. Its main purpose is to maintain the distance between the LCD panel glass substrates, thereby preventing Mura defects caused by non-uniform liquid crystal thickness. It enables high-resolution, elastic structures crucial for modern, high-performance displays.

Performance & Characteristics

  • High Sensitivity
  • High Resolution
  • High Uniformity
  • High Development Residual Film Rate
  • Good Elastic and Plastic Deformation Properties
  • Excellent Mechanical Strength
image
image
image
image


Other Applications

Low Temperature Photoresist

  • Lower oven temperature (180ºC)
  • ESG implementation
image
image

High Thickness Products 

  • E-paper
  • PDLC glass      
  • Privacy filter

Black Photo Spacer (BPS) 

  • OD > 1.2/µm, CD~20 µm

Our Product Types

Normal PSFine PSSuperFine PS
Bottom CD-Top CD (µm)> 10µm7~10 µm< 6 µm
ApplicationTV / ITNB / MNT / TPCMB / Pad / MNT / TPC / AR / VR
Elastic Recovery RatioLowMiddleHigh

TG-ASeries Positive Photoresist

High Sensitivity & High adhesion property positive resist, Optimized for FPD production. It is formulated with PGMEA and other safe solvent.

Performance & Characteristics

  • Resolution: 1.5µm
  • High photo sensitivity
  • High Dark Erosion/ mura free
  • Excellent Uniformity
  • Excellent Adhesion on various film
  • Excellent Etching Resistance
  • Wide process margin

Our Products

TG-A03TG-A25TG-A36TG-A68
Viscosity15cP8cP4cP3cP
Coating TypeSpinSpinSlitSlit

Process conditions

  • Coating Type: Spin or slit
  • Viscosity: 3~15 cP
  • Pre-bake: 110oC/ 90secoC/ 90sec
  • Exposure: i line Aligner (ghi-line)
  • Development: 2.38%TMAH
  • Post-bake: 140oC/ 3min
image

TG-SSeries Positive Photoresist

High Sensitivity & High adhesion property positive resist, Optimized for Semiconductor production. It is formulated with PGMEA and other safe solvent.

Performance & Characteristics

  • High photo sensitivity
  • High Dark Erosion
  • Excellent Adhesion on various film
  • Excellent Adhesion on various film
  • Excellent Stripping
  • Various viscosity products

Process conditions

  • Coating Type: Spin or slit
  • Viscosity: 20-115 cP
  • Pre-bake: 100oC/ 90sec 
  • Exposure: i line Aligner (ghi-line)
  • Development: 2.38%TMAH
  • Post-bake: 140oC/ 5min
image
tg1
Film Thickness 10µm
Line/Space: 5.0µm
tg2
Film Thickness 5.0µm
Line/Space: 5.0µm
image
Film Thickness 5.0µm
Line/Space: 2.0µm
image
Film Thickness 10.0µm
Line/Space: 3.0µm
messageimage 1770884754283
Film Thickness 15.0µm
Line/Space: 3.0µm

Our Products

TG-S01TG-S02TG-S03
Viscosity20 cP50 cP115 cP